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author | Michal Marek <mmarek@suse.cz> | 2010-10-28 00:15:57 +0200 |
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committer | Michal Marek <mmarek@suse.cz> | 2010-10-28 00:15:57 +0200 |
commit | b74b953b998bcc2db91b694446f3a2619ec32de6 (patch) | |
tree | 6ce24caabd730f6ae9287ed0676ec32e6ff31e9d /Documentation/hwmon/w83792d | |
parent | abb438526201c6a79949ad45375c051b6681c253 (diff) | |
parent | f6f94e2ab1b33f0082ac22d71f66385a60d8157f (diff) | |
download | kernel_samsung_smdk4412-b74b953b998bcc2db91b694446f3a2619ec32de6.zip kernel_samsung_smdk4412-b74b953b998bcc2db91b694446f3a2619ec32de6.tar.gz kernel_samsung_smdk4412-b74b953b998bcc2db91b694446f3a2619ec32de6.tar.bz2 |
Merge commit 'v2.6.36' into kbuild/misc
Update to be able to fix a recent change to scripts/basic/docproc.c
(commit eda603f).
Diffstat (limited to 'Documentation/hwmon/w83792d')
-rw-r--r-- | Documentation/hwmon/w83792d | 2 |
1 files changed, 1 insertions, 1 deletions
diff --git a/Documentation/hwmon/w83792d b/Documentation/hwmon/w83792d index 14a668e..8a023ce 100644 --- a/Documentation/hwmon/w83792d +++ b/Documentation/hwmon/w83792d @@ -5,7 +5,7 @@ Supported chips: * Winbond W83792D Prefix: 'w83792d' Addresses scanned: I2C 0x2c - 0x2f - Datasheet: http://www.winbond.com.tw/E-WINBONDHTM/partner/PDFresult.asp?Pname=1035 + Datasheet: http://www.winbond.com.tw Author: Chunhao Huang Contact: DZShen <DZShen@Winbond.com.tw> |