diff options
| author | Fenghua Yu <fenghua.yu@intel.com> | 2010-07-29 17:13:46 -0700 |
|---|---|---|
| committer | H. Peter Anvin <hpa@linux.intel.com> | 2010-08-03 15:58:56 -0700 |
| commit | a3159864f2978bf2ace9cc787d73d315c98bbf9a (patch) | |
| tree | c7662d6b515667957a39bfab079b05766dbbb387 /Documentation | |
| parent | 0199114c31798af5b83841b21759b64171060d9b (diff) | |
| download | kernel_samsung_smdk4412-a3159864f2978bf2ace9cc787d73d315c98bbf9a.zip kernel_samsung_smdk4412-a3159864f2978bf2ace9cc787d73d315c98bbf9a.tar.gz kernel_samsung_smdk4412-a3159864f2978bf2ace9cc787d73d315c98bbf9a.tar.bz2 | |
x86, hwmon: Package Level Thermal/Power: pkgtemp documentation
Document for package level thermal hwmon driver.
Signed-off-by: Fenghua Yu <fenghua.yu@intel.com>
LKML-Reference: <1280448826-12004-6-git-send-email-fenghua.yu@intel.com>
Reviewed-by: Len Brown <len.brown@intel.com>
Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
Diffstat (limited to 'Documentation')
| -rw-r--r-- | Documentation/hwmon/pkgtemp | 36 |
1 files changed, 36 insertions, 0 deletions
diff --git a/Documentation/hwmon/pkgtemp b/Documentation/hwmon/pkgtemp new file mode 100644 index 0000000..c8e1fb0 --- /dev/null +++ b/Documentation/hwmon/pkgtemp @@ -0,0 +1,36 @@ +Kernel driver pkgtemp +====================== + +Supported chips: + * Intel family + Prefix: 'pkgtemp' + CPUID: + Datasheet: Intel 64 and IA-32 Architectures Software Developer's Manual + Volume 3A: System Programming Guide + +Author: Fenghua Yu + +Description +----------- + +This driver permits reading package level temperature sensor embedded inside +Intel CPU package. The sensors can be in core, uncore, memory controller, or +other components in a package. The feature is first implemented in Intel Sandy +Bridge platform. + +Temperature is measured in degrees Celsius and measurement resolution is +1 degree C. Valid temperatures are from 0 to TjMax degrees C, because the actual +value of temperature register is in fact a delta from TjMax. + +Temperature known as TjMax is the maximum junction temperature of package. +We get this from MSR_IA32_TEMPERATURE_TARGET. If the MSR is not accessible, +we define TjMax as 100 degrees Celsius. At this temperature, protection +mechanism will perform actions to forcibly cool down the package. Alarm +may be raised, if the temperature grows enough (more than TjMax) to trigger +the Out-Of-Spec bit. Following table summarizes the exported sysfs files: + +temp1_input - Package temperature (in millidegrees Celsius). +temp1_max - All cooling devices should be turned on. +temp1_crit - Maximum junction temperature (in millidegrees Celsius). +temp1_crit_alarm - Set when Out-of-spec bit is set, never clears. + Correct CPU operation is no longer guaranteed. |